Found 44 results
| Compare | Product Image | Package Form | Lifecycle Status | Polarity | Tolerance | Operating Temp. (℃) | Rated Life (Hours) | ESR (max.) | ESR Frequency | Rated Ripple Current | Leakage Current Max | tanδ max. | Dimension L (mm) | Width W (mm) | Dimension H (mm) | Terminal Pitch (mm) | Terminal Material | Weight | Min. Package Qty | Feature Tags | AEC-Q200 | 3D-CAD | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | SMD | TQD101M1CD15100RN | TQD15 | Mass Production | Polarized | 16 V | 100 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 160 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD151M1CD15100RD | TQD15 | Mass Production | Polarized | 16 V | 150 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 160 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD151M1CD15100RN | TQD15 | Mass Production | Polarized | 16 V | 150 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 160 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD470M1DD15045RN | TQD15 | Mass Production | Polarized | 20 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 45 mΩ | 100 kHz | 2000 mArms | 94 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD470M1VD15100RN | TQD15 | Mass Production | Polarized | 35 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 164.5 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD470M1VD15120RN | TQD15 | Mass Production | Polarized | 35 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 120 mΩ | 100 kHz | 1200 mArms | 164.5 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD680M1VD15100RN | TQD15 | Mass Production | Polarized | 35 V | 68 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 238 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD4R7M1HD15100RN | TQD15 | Mass Production | Polarized | 50 V | 4.7 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 235 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD100M1JD15100RN | TQD15 | Mass Production | Polarized | 63 V | 10 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 164.5 µA | 10 | 7.3 mm | 4.3 mm | 1.5 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 211.8825 g | 1000 | Low ESR, high ripple current, large capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD680M1CD19090RN | TQD19 | Mass Production | Polarized | 16 V | 68 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 90 mΩ | 100 kHz | 1500 mArms | 108.8 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD101M1CD19100RN | TQD19 | Mass Production | Polarized | 16 V | 100 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 160 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD101M1CD19050RN | TQD19 | Mass Production | Polarized | 16 V | 100 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 50 mΩ | 100 kHz | 2200 mArms | 160 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD151M1CD19050RN | TQD19 | Mass Production | Polarized | 16 V | 150 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 50 mΩ | 100 kHz | 2200 mArms | 240 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD151M1CD19100RN | TQD19 | Mass Production | Polarized | 16 V | 150 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 240 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD330M1ED19060RN | TQD19 | Mass Production | Polarized | 25 V | 33 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 60 mΩ | 100 kHz | 1900 mArms | 82.5 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD470M1VD19100RN | TQD19 | Mass Production | Polarized | 35 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 164.5 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD680M1VD19100RN | TQD19 | Mass Production | Polarized | 35 V | 68 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 238 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD680M1VD19120RN | TQD19 | Mass Production | Polarized | 35 V | 68 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 120 mΩ | 100 kHz | 1200 mArms | 238 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD100M1JD19060RN | TQD19 | Mass Production | Polarized | 63 V | 10 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 60 mΩ | 100 kHz | 1900 mArms | 63 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD100M1JD19100RN | TQD19 | Mass Production | Polarized | 63 V | 10 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1400 mArms | 63 µA | 10 | 7.3 mm | 4.3 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 268.3845 g | 1000 | Low ESR, high ripple current, high capacitance, wide temperature range | — | Apply | ||
![]() | SMD | TQD331M1AD28070RN | TQD28 | Mass Production | Polarized | 10 V | 330 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 70 mΩ | 100 kHz | 2100 mArms | 330 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD151M1CD28050RN | TQD28 | Mass Production | Polarized | 16 V | 150 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 50 mΩ | 100 kHz | 2300 mArms | 240 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD221M1CD28050RN | TQD28 | Mass Production | Polarized | 16 V | 220 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 50 mΩ | 100 kHz | 2300 mArms | 352 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD221M1CD28100RN | TQD28 | Mass Production | Polarized | 16 V | 220 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1800 mArms | 352 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD271M1CD28050RN | TQD28 | Mass Production | Polarized | 16 V | 270 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 50 mΩ | 100 kHz | 2300 mArms | 432 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD101M1DD28100RN | TQD28 | Mass Production | Polarized | 20 V | 100 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1800 mArms | 200 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD470M1ED28060RN | TQD28 | Mass Production | Polarized | 25 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 60 mΩ | 100 kHz | 2200 mArms | 117.5 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD470M1ED28100RN | TQD28 | Mass Production | Polarized | 25 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1800 mArms | 117.5 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD680M1ED28060RN | TQD28 | Mass Production | Polarized | 25 V | 68 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 60 mΩ | 100 kHz | 2200 mArms | 170 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD680M1ED28100RN | TQD28 | Mass Production | Polarized | 25 V | 68 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1800 mArms | 170 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD101M1VD28120RN | TQD28 | Mass Production | Polarized | 35 V | 100 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 120 mΩ | 100 kHz | 1600 mArms | 350 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD4R7M2AD28100RN | TQD28 | Mass Production | Polarized | 100 V | 4.7 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 1900 mArms | 47 µA | 10 | 7.3 mm | 4.3 mm | 2.8 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 395.514 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD331M1AD42100RN | TQD42 | Mass Production | Polarized | 10 V | 330 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 330 µA | 10 | 7.3 mm | 4.3 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 593.271 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD331M1CD42100RN | TQD42 | Mass Production | Polarized | 16 V | 330 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 528 µA | 10 | 7.3 mm | 4.3 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 593.271 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD471M1CD42100RN | TQD42 | Mass Production | Polarized | 16 V | 470 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 752 µA | 10 | 7.3 mm | 4.3 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 593.271 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD470M1HD42100RN | TQD42 | Mass Production | Polarized | 50 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 235 µA | 10 | 7.3 mm | 4.3 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 593.271 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD680M1HD42100RN | TQD42 | Mass Production | Polarized | 50 V | 68 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 340 µA | 10 | 7.3 mm | 4.3 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 593.271 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQD120M2AD42100RN | TQD42 | Mass Production | Polarized | 100 V | 12 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 12 µA | 10 | 7.3 mm | 4.3 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 593.271 g | 500 | Low ESR, High Ripple Current Capability, RoHS Compliant, Long Service Life, High Capacitance, Small Form Factor | — | Apply | ||
![]() | SMD | TQW221M1EW19100RN | TQW19 | Mass Production | Polarized | 25 V | 220 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 550 µA | 10 | 7.3 mm | 6 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 374.49 g | 400 | High Capacitance Density, Low ESR, High Ripple Current Capability, RoHS Compliant, Low ESL | — | Apply | ||
![]() | SMD | TQW101M1VW19100RN | TQW19 | Mass Production | Polarized | 35 V | 100 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2000 mArms | 350 µA | 10 | 7.3 mm | 6 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 374.49 g | 400 | High Capacitance Density, Low ESR, High Ripple Current Capability, RoHS Compliant, Low ESL | — | Apply | ||
![]() | SMD | TQW101M1VW19120RN | TQW19 | Mass Production | Polarized | 35 V | 100 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 120 mΩ | 100 kHz | 1800 mArms | 350 µA | 10 | 7.3 mm | 6 mm | 1.9 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 374.49 g | 400 | High Capacitance Density, Low ESR, High Ripple Current Capability, RoHS Compliant, Low ESL | — | Apply | ||
![]() | SMD | TQW151M1VW42100RN | TQW42 | Mass Production | Polarized | 35 V | 150 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2050 mArms | 525 µA | 10 | 7.3 mm | 6 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 827.82 g | 400 | Low ESR, High Ripple Current Capability, Low ESL, Long Service Life, Wide Temperature Range | — | Apply | ||
![]() | SMD | TQW221M1VW42100RN | TQW42 | Mass Production | Polarized | 35 V | 220 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 100 mΩ | 100 kHz | 2050 mArms | 770 µA | 10 | 7.3 mm | 6 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 827.82 g | 400 | Low ESR, High Ripple Current Capability, Low ESL, Long Service Life, Wide Temperature Range | — | Apply | ||
![]() | SMD | TQW470M1HW42060RN | TQW42 | Mass Production | Polarized | 50 V | 47 µF | ±20% | -55 ~ 105 ℃ | 2000 h | 60 mΩ | 100 kHz | 2600 mArms | 235 µA | 10 | 7.3 mm | 6 mm | 4.2 mm | 5.3 mm | Copper, nickel-plated then tin-plated | 827.82 g | 400 | Low ESR, High Ripple Current Capability, Low ESL, Long Service Life, Wide Temperature Range | — | Apply |






