YMIN TQ Series Polymer Tantalum Capacitors: High Voltage & High Capacitance Power Supply and Power Loss Protection Solution for Enterprise SSDs
Sep 29, 2026General
As enterprise-grade SSDs evolve toward ultra-thin profiles, high density, and 24/7 stable operation, power supply and power-loss protection requirements demand capacitors that are compact, high-capacitance, low-ESR, low-leakage, and highly reliable. Yongming’s TQ series (TQD/TQW) polymer tantalum capacitors feature a bottom-terminal structure; this design—encompassing structure, materials, packaging, and production—systematically addresses key challenges in SSD capacitor selection.
Structural Comparison: Conventional Tantalum Capacitors vs. Yongming Bottom-Terminal Structure
Conventional Tantalum Capacitor (Leaded Structure): Features leads with two bends and greater lead length; limited internal space, with the tantalum core occupying approximately 36% of the volume.
Yongming Bottom-Terminal Structure: Leadless design with no bends; the tantalum core connects directly to the substrate; increased internal space, with the tantalum core occupying approximately 43% of the volume.
Figure 1: Structure of traditional tantalum capacitors vs. Yongming's new tantalum capacitors
Key Advantages: Yongming's New Tantalum Capacitors vs. Traditional Tantalum Capacitors
① Higher capacitance, thinner profile, and smaller footprint
Under identical conditions (35V), the capacitance of the new tantalum capacitors increases by approximately 19%.
By eliminating the space occupied by the lead frame, internal space utilization improves from 36% to 43%, making them better suited for ultra-thin SSDs.
By eliminating the space occupied by the lead frame, internal space utilization improves from 36% to 43%, making them better suited for ultra-thin SSDs.
Typical Comparisons:
Thinner profile: 68μF 35V, 7.3×4.3×2.8 mm → 7.3×4.3×1.9 mm
Smaller footprint: 22μF 25V, 7.3×4.3×1.9 mm → 3.5×2.8×1.9 mm
Figure 2: Capacitance comparison of 68μF/35V polymer capacitors with two different structural designs
② Low leakage current
Traditional lead-frame designs require secondary bending, which subjects the tantalum core to mechanical stress and creates a risk of increased leakage current; in contrast, Yongming’s bottom-terminal structure eliminates the need for bending, resulting in more stable leakage current.
Regarding packaging, traditional methods involve melting temperatures up to 180°C and require approximately 10 kg of pressure during the molding process; the pressure exerted on the internal tantalum core can lead to higher leakage current. Yongming employs advanced packaging technology featuring a lower curing temperature (150°C), a non-injection molding process, and ultra-low stress, resulting in superior leakage current performance.
Figure 3. Comparison of leakage current between bottom-terminal and traditional L-shaped configurations under identical specifications and room temperature.
Figure 4: Comparison of leakage current between bottom-terminal and traditional L-shaped designs under identical specifications at a high temperature of 105°C.
Key Electrical Performance and Reliability
① Multiple moisture-protection measures: Passed "Double 85" testing.
In "Double 85" testing, capacitance and leakage current remained stable and well within specification limits. No short-circuit failures occurred during testing, making the components suitable for long-term operation.
② More stable capacitance over the service life: Charge-discharge testing
Yongming TQ series polymer tantalum capacitors have successfully passed power-cycling tests across a temperature range of -5°C to +85°C, covering 20,000 cycles and a voltage range of 0V to UR. Post-test capacitance variation was approximately -5%, meeting the operational requirements for SSD power cycling.
Figure 5 TQD15 35V 47μF: Capacitance vs. Charge/Discharge Curve at -5°C Ambient Temperature
Figure 6: TQD15 (35V, 47μF, 85°C ambient temperature) – Capacitance vs. Charge/Discharge Cycle Curve
Withstands 20,000 charge/discharge cycles with stable capacitance, meeting the operational requirements for SSD power-up and power-down sequences.
Recommended TQ Series for SSD Applications
Cross-reference with peers: The Yongming TQ series offers pin-to-pin compatibility with equivalent specifications from mainstream brands. Specific replacement solutions should be verified by evaluating factors such as circuit derating, ripple current, service life requirements, and PCB layout.
Conclusion
The Yongming TQ series of polymer tantalum capacitors offers significant advantages—including a low profile, high voltage rating, high capacitance, low ESR, low leakage current, and high reliability—making them ideally suited for applications such as enterprise-grade SSDs, AI data centers, and edge computing.
This article is from the YMIN website. Always refer to the latest datasheet for product selection.